Semiconductor device and method for manufacturing same

ABSTRACT

A silicon carbide substrate includes: an n type drift layer having a first surface and a second surface opposite to each other; a p type body region provided in the first surface of the n type drift layer; and an n type emitter region provided on the p type body region and separated from the n type drift layer by the p type body region. A gate insulating film is provided on the p type body region so as to connect the n type drift layer and the n type emitter region to each other. A p type Si collector layer is directly provided on the silicon carbide substrate to face the second surface of the n type drift layer.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method formanufacturing the semiconductor device, more particularly, asemiconductor device having a silicon carbide substrate and a method formanufacturing such a semiconductor device.

2. Description of the Background Art

Japanese Patent Laying-Open No. 2008-288349 (Patent Literature 1)discloses an n type IGBT (Insulated Gate Bipolar Transistor) employing asilicon substrate. Such an IGBT has a p type collector layer, which isformed by means of ion implantation and heat treatment after forming astructure of the emitter side on a silicon substrate.

In recent years, instead of a silicon substrate, use of a siliconcarbide substrate has been considered as a substrate for a powersemiconductor device. An impurity provided in silicon carbide (SiC) bymeans of ion implantation is activated normally at a heat treatmenttemperature of approximately 1500° C. or greater, which is much higherthan the heat treatment temperature for activating an impurity providedin silicon by means of ion implantation. Accordingly, if the techniqueof Japanese Patent Laying-Open No. 2008-288349 is applied to a methodfor manufacturing an IGBT using a silicon carbide substrate, thestructure of emitter side is damaged due to the high-temperatureheating. Accordingly, it is difficult to apply this technique.

Japanese National Patent Publication No. 2010-529646 (Patent Literature2) discloses that when manufacturing an IGBT using a silicon carbidesubstrate, a p type collector layer is formed on an n type siliconcarbide substrate by means of epitaxial growth, then a structure ofemitter side is formed, and then the n type silicon carbide substrate isremoved.

According to the technique described in Japanese National PatentPublication No. 2010-529646, epitaxial growth of p type SiC is requiredto form the p type collector layer. However, this technique is highlydifficult. In particular, it is highly difficult to attain the epitaxialgrowth of p type SiC on an n type silicon carbide substrate, which canbe manufactured readily to have higher quality and larger size than a ptype silicon carbide substrate.

SUMMARY OF THE INVENTION

The present invention has been made to solve the foregoing problem, andhas one object to provide a semiconductor device that has a siliconcarbide substrate and a p type collector layer and that can bemanufactured readily. Another object thereof is to provide a method formanufacturing a semiconductor device, whereby a semiconductor devicehaving a silicon carbide substrate and a p type collector layer can bereadily manufactured.

A semiconductor device includes a silicon carbide substrate, a gateinsulating film, a gate electrode, an emitter electrode, and a p type Sicollector layer. The silicon carbide substrate includes an n type driftlayer having first and second surfaces opposite to each other, a p typebody region provided in the first surface of the n type drift layer, andan n type emitter region provided on the p type body region andseparated from the n type drift layer by the p type body region. Thegate insulating film is provided on the p type body region so as toconnect the n type drift layer and the n type emitter region to eachother. The gate electrode is provided on the gate insulating film. Theemitter electrode is in contact with each of the n type emitter regionand the p type body region. The p type Si collector layer is directlyprovided on the silicon carbide substrate to face the second surface ofthe n type drift layer.

According to the above-described semiconductor device, each of theemitter region, the body region, and the drift region is made of siliconcarbide, so that a semiconductor device employing properties of siliconcarbide is obtained. Further, because the Si layer is used as thecollector layer, epitaxial growth of p type SiC, which is highlydifficult, is not required in forming the collector layer. Hence, thesemiconductor device can be manufactured more readily.

In the semiconductor device, the p type Si collector layer may be madeof polysilicon. In this way, the p type Si collector layer can beadapted to have an electric conductivity higher than that in the casewhere the p type Si collector layer is made of amorphous silicon.

In the semiconductor device, the p type Si collector layer may be madeof amorphous silicon. Accordingly, the p type Si collector layer can beformed at a temperature lower than that in the case where the p type Sicollector layer is made of polysilicon.

In the semiconductor device, the silicon carbide substrate may include ap type SiC layer separated from the p type body region by the n typedrift layer and disposed directly on the p type Si collector layer. Inthis way, in addition to the p type Si collector layer, the p type SiClayer can be used as a source of supply of positive holes into the ntype drift layer. Thus, more sufficient amount of positive holes can besupplied into the n type drift layer.

A method for manufacturing a semiconductor device in the presentinvention includes the following steps. A silicon carbide substratehaving an n type single-crystal substrate made of silicon carbide and ann type drift layer provided thereon is formed by epitaxially growingsilicon carbide on the n type single-crystal substrate while adding adonor type impurity thereto. The n type drift layer has first and secondsurfaces opposite to each other. The second surface faces the n typesingle-crystal substrate. There are formed a p type body region disposedin the first surface of the n type drift layer, and an n type emitterregion disposed on the p type body region and separated from the n typedrift layer by the p type body region. A gate insulating film is formedon the p type body region so as to connect the n type drift layer andthe n type emitter region to each other. A gate electrode is formed onthe gate insulating film. An emitter electrode is formed in contact witheach of the n type emitter region and the p type body region. A p typeSi collector layer facing the second surface of the n type drift layeris formed by depositing silicon on the silicon carbide substrate whileadding an acceptor type impurity thereto.

According to the above-described semiconductor device, each of theemitter region, the body region, and the drift region is made of siliconcarbide, so that a semiconductor device employing properties of siliconcarbide is obtained. Further, because the Si layer is used as thecollector layer, epitaxial growth of p type SiC, which is highlydifficult, is not required in forming the collector layer. Hence, thesemiconductor device can be manufactured more readily. Further, by usingthe Si layer as the collector layer, temperature required for the stepof forming the collector layer can be made low. Accordingly, damage thatcan be caused by the heating during the formation of the collector layercan be suppressed.

In the above-described manufacturing method, activation heat treatmentfor the p type Si collector layer may be performed. In this way, theimpurity in the p type Si collector layer can be more activated.

In the above-described manufacturing method, a collector electrode maybe formed on the p type Si collector layer after performing theactivation heat treatment. Accordingly, electrical connection with the ptype Si collector layer can be readily achieved.

In the above-described manufacturing method, during the activation heattreatment, the p type Si collector layer may be irradiated with laserlight. Accordingly, local heating can be done, thereby suppressing thesemiconductor device from being damaged due to the heating for theactivation of the collector layer.

In the above-described manufacturing method, an emitter wire having amelting point lower than that of the emitter electrode may be formed onthe emitter electrode before forming the p type Si collector layer. Inthis case, by using the Si layer formed at a relatively low temperatureas the collector layer, there can be suppressed damage, which is morelikely to occur by heating the emitter wire having low heat resistance.

In the above-described manufacturing method, at least a portion of the ntype single-crystal substrate may be removed after the step of formingthe n type drift layer. Accordingly, the semiconductor device can bethinned.

In the above-described manufacturing method, a p type SiC layer facingthe second surface of the n type drift layer may be formed beforeforming the p type Si collector layer, the p type SiC layer being formedby implanting an acceptor type impurity into the silicon carbidesubstrate by means of an ion implantation method and irradiating thesilicon carbide substrate with laser light. In this case, by forming thep type Si collector layer in contact with the p type SiC layer, the ptype Si collector layer is formed.

In this way, in addition to the p type Si collector layer, the p typeSiC layer can be used as a source of supply of positive holes into the ntype drift layer. Thus, more sufficient amount of positive holes can besupplied into the n type drift layer.

As described above, according to the present invention, there can bereadily manufactured a semiconductor device having a silicon carbidesubstrate and a p type collector layer.

The foregoing and other objects, features, aspects and advantages of thepresent invention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view schematically showing a configurationof a semiconductor device in a first embodiment of the presentinvention.

FIG. 2 is a cross sectional view schematically showing a first step in amethod for manufacturing the semiconductor device of FIG. 1.

FIG. 3 is a cross sectional view schematically showing a second step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 4 is a cross sectional view schematically showing a third step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 5 is a cross sectional view schematically showing a fourth step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 6 is a cross sectional view schematically showing a fifth step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 7 is a cross sectional view schematically showing a sixth step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 8 is a cross sectional view schematically showing a seventh step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 9 is a cross sectional view schematically showing an eighth step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 10 is a cross sectional view schematically showing a ninth step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 11 is a cross sectional view schematically showing a tenth step inthe method for manufacturing the semiconductor device of FIG. 1.

FIG. 12 is a cross sectional view schematically showing a configurationof a semiconductor device in a second embodiment of the presentinvention.

FIG. 13 is a cross sectional view schematically showing a first step ina method for manufacturing the semiconductor device of FIG. 12.

FIG. 14 is a cross sectional view schematically showing a second step inthe method for manufacturing the semiconductor device of FIG. 12.

FIG. 15 is a cross sectional view schematically showing a third step inthe method for manufacturing the semiconductor device of FIG. 12.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following describes embodiments of the present invention withreference to figures. It should be noted that in the below-mentionedfigures, the same or corresponding portions are given the same referencecharacters and are not described repeatedly. Regarding crystallographicindications of the present specification, an individual plane isrepresented by ( ) and a group plane is represented by { }. In addition,a negative index is supposed to be crystallographically indicated byputting “−” (bar) above a numeral, but is indicated by putting thenegative sign before the numeral in the present specification.

First Embodiment

As shown in FIG. 1, an IGBT 91 (semiconductor device) of the presentembodiment includes a silicon carbide substrate 30, a gate insulatingfilm 11, a gate electrode 9, emitter electrodes 42, an emitter wire 43,a p type Si collector layer 70, a collector electrode 44, an interlayerinsulating film 10, and a protecting electrode 15.

Silicon carbide substrate 30 is made of silicon carbide having ahexagonal crystal structure or silicon carbide having a cubic crystalform. Silicon carbide substrate 30 has an n type drift layer 32, p typebody regions 33, and n type emitter regions 34.

N type drift layer 32 has an upper surface S1 (first surface) and alower surface S2 (second surface) opposite to each other. In the casewhere silicon carbide substrate 30 has a hexagonal crystal structure,upper surface S1 preferably includes a {0001} plane or a plane inclinedby 4° or smaller relative to the {0001} plane. In the case where siliconcarbide substrate 30 has a cubic crystal structure, upper surface S1includes a {100} plane.

N type emitter regions 34 are provided on p type body regions 33.Further, n type emitter regions 34 are separated from n type drift layer32 by p type body regions 33.

Each of p type body regions 33 is provided in upper surface S1 of n typedrift layer 32. Further, p type body region 33 has a p region 33 a, anda p⁺ region 33 b. P ⁺ region 33 b has an impurity concentration higherthan that of p region 33 a. P region 33 a is in contact with gateinsulating film 11. P⁺ region 33 b is in contact with emitter electrode42.

Gate insulating film 11 is provided on p type body region 33 so as toconnect n type drift layer 32 and n type emitter regions 34 to oneanother. Gate insulating film 11 is made of, for example, silicon oxide(SiO₂) formed by a thermal oxidation method. Gate electrode 9 isprovided on gate insulating film 11.

Emitter electrode 42 is in contact with each of n type emitter region 34and p⁺ region 33 b of p type body region 33. Emitter wire 43 is providedon emitter electrode 42 and is electrically connected to emitterelectrode 42. Emitter wire 43 is made of, for example, aluminum.

P type Si collector layer 70 is provided directly on silicon carbidesubstrate 30 so as to face lower surface S2 of n type drift layer 32. Ptype Si collector layer 70 may be made of polysilicon or amorphoussilicon.

Collector electrode 44 is an ohmic electrode provided on p type Sicollector layer 70. Collector electrode 44 includes: a Ni layer facing ptype Si collector layer 70; and a Au layer provided on the Ni layer, forexample. Instead of the Ni layer and the Au layer, a Ti layer and an Allayer may be used, respectively. Protecting electrode 15 coverscollector electrode 44.

The following describes gist of usage of IGBT 91. A voltage is appliedbetween emitter wire 43 and protecting electrode 15 such that protectingelectrode 15 has a positive potential relative to emitter wire 43.Electric conduction between emitter wire 43 and protecting electrode 15is switched in accordance with a potential applied to gate electrode 9.

Specifically, when gate electrode 9 is fed with a negative potentialexceeding a threshold value, an inversion layer is formed in each p typebody region 33 at a region (channel region) facing gate electrode 9 withgate insulating film 11 interposed therebetween. Accordingly, n typeemitter region 34 and n type drift layer 32 are electrically connectedto each other. Accordingly, electrons are injected from n type emitterregion 34 into n type drift layer 32. Correspondingly, positive holesare supplied from p type Si collector layer 70 into n type drift layer32. As a result, conductivity modulation takes place in n type driftlayer 32, thus significantly decreasing a resistance between emitterelectrode 42 and collector electrode 44. In other words, IGBT 90 isbrought into ON state.

Meanwhile, when gate electrode 9 is not fed with the above-describedpotential, no inversion layer is formed in the channel region, therebymaintaining a reverse-bias state between n type drift layer 32 and ptype body region 33. Thus, IGBT 90 is in OFF state.

The following describes a method for manufacturing IGBT 91.

Referring to FIG. 2, an n type single-crystal substrate 20 made ofsilicon carbide is prepared. Preferably, n type single-crystal substrate20 has the same crystal structure as that of silicon carbide substrate30 (FIG. 1). More preferably, n type single-crystal substrate 20 has amain surface (upper surface in the figure) having the same planeorientation as that of upper surface S1.

Next, n type drift layer 32 is formed on n type single-crystal substrate20. N type drift layer 32 has upper surface S1 and lower surface S2opposite to each other. Lower surface S2 faces n type single-crystalsubstrate 20. In this way, silicon carbide substrate 30 is formed whichhas n type single-crystal substrate 20 and n type drift layer 32provided thereon.

The formation of n type drift layer 32 is performed by epitaxiallygrowing silicon carbide on n type single-crystal substrate 20 whileadding a donor type impurity. The epitaxial growth is performed by, forexample, chemical vapor deposition (CVD) method. In the CVD method, afilm formation temperature is approximately 1400° C., for example. As asource material gas in the CVD method, a mixed gas of silane (SiH₄) andpropane (C₃H₈) can be used. As the donor type impurity, nitrogen (N) orphosphorus (P) can be used, for example. As a carrier gas for the sourcematerial gas, hydrogen gas (H₂) can be used, for example.

Referring to FIG. 3, p type body regions 33 each having p region 33 aand p+ region 33 b, and n type emitter regions 34 are formed by means ofion implantation. Each of p type body regions 33 is formed in uppersurface S1 of n type drift layer 32. Each of n type emitter regions 34is formed on p type body region 33 and is separated from n type driftlayer 32 by p type body region 33. In the ion implantation for forming ptype body region 33, aluminum (Al) or the like can be implanted, forexample. In the ion implantation for forming n type emitter region 34,phosphorus (P) or the like can be implanted, for example.

Next, heat treatment is performed to activate the implanted impurities.Preferably, the heat treatment is performed at a temperature of morethan 1600° C., preferably 1750° C. or greater. Further, the heattreatment is preferably performed at a temperature of not more than1900° C. For example, the heat treatment is performed at a temperatureof approximately 1750° C. The heat treatment is performed forapproximately 30 minutes, for example. The atmosphere of the heattreatment is preferably an inert gas atmosphere, such as Ar atmosphere.

Referring to FIG. 4, gate insulating film 11 is formed on siliconcarbide substrate 30. For example, a surface of silicon carbidesubstrate 30 is thermally oxidized.

Referring to FIG. 5, gate electrode 9 is formed on gate insulating film11. For example, first, the CVD method is employed to form a polysiliconfilm having a high electric conductivity provided by adding an impuritytherein. Then, this film is patterned.

Referring to FIG. 6, interlayer insulating film 10 is formed. Further,gate insulating film 11 is patterned to have a remaining portionconnecting n type drift layer 32 and n type emitter region 34 to eachother on p type body region 33.

Referring to FIG. 7, emitter electrodes 42 are formed which are ohmicelectrodes in contact with n type emitter regions 34 and p type bodyregions 33.

Referring to FIG. 8, emitter wire 43 is formed on emitter electrode 42.Emitter wire 43 may have a melting point lower than that of each emitterelectrode 42. For example, emitter wire 43 is made of aluminum.

Referring to FIG. 9, at least a portion of n type single-crystalsubstrate 20 (FIG. 8) is removed from silicon carbide substrate 30. Inthe present embodiment, whole of n type single-crystal substrate 20 isremoved. As a method for removing n type single-crystal substrate 20, aback grind process can be employed, for example. It should be noted thatthe step of removing at least the portion of n type single-crystalsubstrate 20 is performed at least after the step of forming n typedrift layer 32. In the present embodiment, the step of removing isperformed after forming the emitter electrode system, i.e., emitterelectrodes 42 and emitter wire 43.

Referring to FIG. 10, by depositing silicon on silicon carbide substrate30 while adding an acceptor type impurity thereto, p type Si collectorlayer 70 is formed to face second surface S2 of n type drift layer 32.Specifically, for example, a p type polysilicon film is formed by meansof the CVD method. The film forming temperature is, for example,approximately 600° C. It should be noted that instead of polysilicon, anamorphous silicon film may be formed.

Referring to FIG. 11, collector electrode 44 serving as an ohmicelectrode is formed on p type Si collector layer 70.

Referring to FIG. 1 again, protecting electrode 15 is formed to covercollector electrode 44. In this way, IGBT 91 is obtained.

It should be noted that in the above-described manufacturing method,activation heat treatment may be provided to p type Si collector layer70. This activation heat treatment may be performed at a temperaturelower than a temperature normally employed when activating an impurityimplanted into silicon carbide by means of ion implantation.Specifically, the heat treatment is performed at a temperature lowerthan the melting point of the material of p type Si collector layer 70,i.e., the melting point of silicon, for example, at a temperature of1400° C. or smaller. For example, the heat treatment is performed at atemperature of approximately 1000° C. Further, the activation heattreatment may be performed by means of laser annealing. In other words,during the activation heat treatment, p type Si collector layer 70 maybe irradiated with laser light. Further, the activation heat treatmentis preferably performed before forming the collector electrode on p typeSi collector layer 70.

According to the present embodiment, each of the emitter region, thebody region, and the drift region in IGBT 91 (FIG. 1) is made of siliconcarbide, so that a semiconductor device employing properties of siliconcarbide is obtained. Further, because the Si layer is used as thecollector layer, epitaxial growth of p type SiC, which is highlydifficult, is not required in forming the collector layer. Hence, IGBT91 can be manufactured more readily.

Further, by using the Si layer as the collector layer, heatingtemperature required for formation of the collector layer becomes low.Accordingly, IGBT 91 can be suppressed from being damaged due to heatingduring the formation of the collector layer. In the case where p type Sicollector layer 70 is made of amorphous silicon, p type Si collectorlayer 70 can be formed at a temperature lower than that in the casewhere p type Si collector layer 70 is made of polysilicon. Accordingly,IGBT 91 can be more suppressed from being damaged due to the heating. Inthe case where p type Si collector layer 70 is made of polysilicon, ptype Si collector layer 70 can be adapted to have an electricconductivity higher than that in the case where p type Si collectorlayer 70 is made of amorphous silicon.

In the case where activation heat treatment for p type Si collectorlayer 70 is performed, the impurity in p type Si collector layer 70 canbe activated more.

In the case where emitter wire 43 having a lower melting point than thatof emitter electrode 42 is formed on emitter electrode 42 before formingp type Si collector layer 70, damage, which is more likely to occur dueto heating of emitter wire 43 having low heat resistance, can besuppressed by using a Si layer formed at a temperature lower than thatof a SiC layer as the collector layer.

In the case where at least a portion of the n type single-crystalsubstrate is removed after the step of forming n type drift layer 32,IGBT 91 can be thinned.

In the case where the collector electrode is formed on p type Sicollector layer 70 after performing the activation heat treatment,electrical connection with p type Si collector layer 70 can be readilyachieved.

In the case where p type Si collector layer 70 is irradiated with laserlight during the activation heat treatment, local heating can be done,thereby suppressing IGBT 91 from being damaged due to heating foractivation of the collector layer.

Second Embodiment

Referring to FIG. 12, in an IGBT 92 (semiconductor device) of thepresent embodiment, a silicon carbide substrate 30 v includes a p typeSiC layer 31. P type SiC layer 31 is separated from p type body region33 by n type drift layer 32, and is directly disposed on p type Sicollector layer 70. Apart from the configuration described above, theconfiguration of the present embodiment is substantially the same as theconfiguration of the first embodiment. Hence, the same or correspondingelements are given the same reference characters and are not describedrepeatedly.

The following describes a manufacturing method in the presentembodiment. First, the same steps as the steps from FIG. 2 to FIG. 9 inthe first embodiment are performed.

Referring to FIG. 13 and FIG. 14, an ion implantation method is thenperformed as indicated by arrows shown therein, thereby implanting anacceptor type impurity into silicon carbide substrate 30. Next, in orderto activate the impurity thus implanted, laser annealing is performed.In other words, silicon carbide substrate 30 is irradiated with laserlight. Accordingly, p type SiC layer 31 is formed to face second surfaceS2 of n type drift layer 32. In other words, by forming p type SiC layer31 on silicon carbide substrate 30 (FIG. 9), silicon carbide substrate30 v (FIG. 14) is formed.

Referring to FIG. 15, p type Si collector layer 70 is formed in contactwith p type SiC layer 31. A specific formation method is substantiallythe same as the process of FIG. 10.

Next, p type SiC layer 31 and p type Si collector layer 70 are subjectedto activation heat treatment. During the activation heat treatment, ptype SiC layer 31 and p type Si collector layer 70 may be irradiatedwith laser light. A specific heat treatment method is substantially thesame as the heat treatment method for p type Si collector layer 70 inthe first embodiment.

Referring to FIG. 12 again, on p type Si collector layer 70, collectorelectrode 44 serving as an ohmic electrode is formed. Next, protectingelectrode 15 is formed to cover collector electrode 44. In this way,IGBT 92 is obtained.

According to the present embodiment, by implanting the acceptor typeimpurity into lower surface S2 of n type drift layer 32 by means of theion implantation method before forming p type Si collector layer 70 andthen irradiating it with laser light (FIG. 13), p type SiC layer 31 isformed on lower surface S2 of n type drift layer 32 (FIG. 14). Further,by forming p type Si collector layer 70 in contact with p type SiC layer31, p type Si collector layer 70 is formed. In this way, in addition top type Si collector layer 70, p type SiC layer 31 can be used as asource of supply of positive holes into n type drift layer 32. Thus,more sufficient amount of positive holes can be supplied into n typedrift layer 32.

It should be noted that the activation heat treatment is performed afterp type Si collector layer 70 is formed in the present embodiment, butthe activation heat treatment may be performed after p type SiC layer 31is formed and before p type Si collector layer 70 is formed. In thisway, damage on p type Si collector layer 70 in the heat treatment can beavoided. As a method for the activation heat treatment, the same methodas that in the first embodiment can be used, for example.

In the present specification, the expression “upper surface S1 includesa {100} plane” is intended to indicate a concept including both a casewhere upper surface S1 substantially corresponds to the {100} plane anda case where there are a plurality of crystal planes constituting uppersurface S1 and one of the crystal planes is the {100} plane.

Although the present invention has been described and illustrated indetail, it is clearly understood that the same is by way of illustrationand example only and is not to be taken by way of limitation, the scopeof the present invention being interpreted by the terms of the appendedclaims.

What is claimed is:
 1. A semiconductor device comprising: a siliconcarbide substrate including an n type drift layer having first andsecond surfaces opposite to each other, a p type body region provided insaid first surface of said n type drift layer, and an n type emitterregion provided on said p type body region and separated from said ntype drift layer by said p type body region; a gate insulating filmprovided on said p type body region so as to connect said n type driftlayer and said n type emitter region to each other; a gate electrodeprovided on said gate insulating film; an emitter electrode in contactwith each of said n type emitter region and said p type body region; anda p type Si collector layer directly provided on said silicon carbidesubstrate to face said second surface of said n type drift layer.
 2. Thesemiconductor device according to claim 1, wherein said p type Sicollector layer is made of polysilicon.
 3. The semiconductor deviceaccording to claim 1, wherein said p type Si collector layer is made ofamorphous silicon.
 4. The semiconductor device according to claim 1,wherein said silicon carbide substrate includes a p type SiC layerseparated from said p type body region by said n type drift layer anddisposed directly on said p type Si collector layer.
 5. A method formanufacturing a semiconductor device, comprising the steps of: forming asilicon carbide substrate having an n type single-crystal substrate madeof silicon carbide and an n type drift layer provided thereon, byepitaxially growing silicon carbide on said n type single-crystalsubstrate while adding a donor type impurity thereto, said n type driftlayer having first and second surfaces opposite to each other, saidsecond surface facing said n type single-crystal substrate; forming a ptype body region disposed in said first surface of said n type driftlayer, and an n type emitter region disposed on said p type body regionand separated from said n type drift layer by said p type body region;forming a gate insulating film on said p type body region so as toconnect said n type drift layer and said n type emitter region to eachother; forming a gate electrode on said gate insulating film; forming anemitter electrode in contact with each of said n type emitter region andsaid p type body region; and forming a p type Si collector layer facingsaid second surface of said n type drift layer, by depositing silicon onsaid silicon carbide substrate while adding an acceptor type impuritythereto.
 6. The method for manufacturing the semiconductor deviceaccording to claim 5, further comprising the step of performingactivation heat treatment for said p type Si collector layer.
 7. Themethod for manufacturing the semiconductor device according to claim 6,further comprising the step of forming a collector electrode on said ptype Si collector layer after the step of performing said activationheat treatment.
 8. The method for manufacturing the semiconductor deviceaccording to claim 6, wherein the step of performing said activationheat treatment includes the step of irradiating said p type Si collectorlayer with laser light.
 9. The method for manufacturing thesemiconductor device according to claim 5, further comprising the stepof forming an emitter wire on said emitter electrode before the step offorming said p type Si collector layer, said emitter wire having amelting point lower than that of said emitter electrode.
 10. The methodfor manufacturing the semiconductor device according to claims 5,further comprising the step of removing at least a portion of said ntype single-crystal substrate after the step of forming said n typedrift layer.
 11. The method for manufacturing the semiconductor deviceaccording to claim 5, further comprising the step of forming a p typeSiC layer facing said second surface of said n type drift layer beforethe step of forming said p type Si collector layer, said p type SiClayer being formed by implanting an acceptor type impurity into saidsilicon carbide substrate by means of an ion implantation method andirradiating said silicon carbide substrate with laser light, wherein thestep of forming said p type Si collector layer is performed by formingsaid p type Si collector layer in contact with said p type SiC layer.